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Lau, John/Kuo-Ning Chiang
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as Cu interconnects, glass-core substrate, 3D heterogeneous integration of photonic IC and electronic IC, and combining simulation design with AI technology to effectively apply it to semiconductor packaging. XXII,547 Seiten mit 487 Farb- und 39 s/w-Abb., gebunden (Springer Nature Singapore 2026) leichte Lagerspuren/unused, minor shelfwear